Application of lead-free eutectic Sn-Ag solder in no-clean thickfilm electronic modules

摘要

As part of the lead-free solder development process currently underway, this paper presents the evaluation of the lead-free Sn-Ag solder for use in no-clean thick film electronics packages. The Sn-Ag (96.5/3.5 wt%) eutectic solder alloy, with a no clean flux system, is the focus of this study. Based on studies of metallurgical interactions, the conductor/substrate adhesion, and electromigration/dendritic growth, it is concluded that this solder has superior overall properties and is suitable for solder interconnects in thick film automotive electronics packages when used with a mixed bonded Ag conductor