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首页> 外文期刊>IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging >A new algorithm for experimental circuit modeling ofinterconnection structures based on causality
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A new algorithm for experimental circuit modeling ofinterconnection structures based on causality

机译:基于因果关系的互连结构实验电路建模的新算法

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摘要

A new algorithm is described for the circuit modeling of two-port interconnection structures starting from S-parameter measurements or simulations. The presented procedure is particularly useful in modeling interconnections with multiple discontinuities. The theory behind the method is based on the principle of causality. Step by step, a circuit model is proposed for each discontinuity and the corresponding parameter values are determined using the time-domain reflection and transmission response derived from the S-parameters. In this way, it is possible to obtain a circuit model for which each element is related to a certain physical part of the passive structure under test. The results show good-agreement between measured and modeled reflection and transmission waveforms
机译:描述了一种新的算法,用于从S参数测量或仿真开始的两端口互连结构的电路建模。所介绍的过程在建模具有多个不连续性的互连时特别有用。该方法背后的理论基于因果关系原理。逐步为每个不连续性提出一个电路模型,并使用从S参数得出的时域反射和传输响应来确定相应的参数值。以这种方式,可以获得电路模型,对于该电路模型,每个元件与被测无源结构的某个物理部分有关。结果表明测量和建模的反射和透射波形之间具有良好的一致性

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