Precision microcomb design and fabrication for x-ray optics assembly

摘要

Silicon microcombs developed at our laboratory for the precision alignment and assembly of large-area foil optics have previously been demonstrated to achieve submicron-level assembly repeatability with submillimeter-thick flat substrates. In this article we report on a double-side deep reactive-ion etch fabrication process using silicon-on-insulator wafers which was developed to improve the microcombs' manufacturing accuracy.