首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structure >Depletion- and enhancement-mode In_(0.49)Ga_(0.51)P/InGaAs/AlGaAs high-electron-mobility transistors with high-breakdown voltage
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Depletion- and enhancement-mode In_(0.49)Ga_(0.51)P/InGaAs/AlGaAs high-electron-mobility transistors with high-breakdown voltage

机译:具有高击穿电压的耗尽型和增强型In_(0.49)Ga_(0.51)P / InGaAs / AlGaAs高电子迁移率晶体管

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摘要

A high-breakdown δ-doped In_(0.49)Ga_(0.51)/InGaAs/AlGaAs high-electron-mobility transistor (HEMT) grown by low-pressure metalorganic chemical vapor deposition has been fabricated and demonstrated successfully. By using a wet etching gate process, we obtained depletion- and enhancement-mode HEMTs. The fabricated devices (1.5X125 μm~2) show that the measured maximum drain saturation current density and extrinsic transconductance are 215 mA/mm and 82 mS/mm for depletion-mode and are 100 mA/mm and 75 mS/mm for enhancement-mode devices, respectively. The gate-to-drain breakdown voltage for both types is over 40 V. The high-breakdown voltage is attributed to the use of an In_(0.49)Ga_(0.51)P Schottky layer, δ-doping, and GaAs subspacer layer.
机译:制备并成功证明了通过低压金属有机化学气相沉积法制备的高击穿δ掺杂In_(0.49)Ga_(0.51)/ InGaAs / AlGaAs高电子迁移率晶体管(HEMT)。通过使用湿蚀刻栅极工艺,我们获得了耗尽型和增强型HEMT。制成的器件(1.5X125μm〜2)表明,对于耗尽模式,测得的最大漏极饱和电流密度和非本征跨导为215 mA / mm和82 mS / mm,增强型为100 mA / mm和75 mS / mm。模式设备。两种类型的栅极到漏极击穿电压都超过40V。高击穿电压归因于In_(0.49)Ga_(0.51)P肖特基层,δ掺杂和GaAs子间隔层的使用。

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