首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Sulfur and low-temperature SiN_x passivation of self-aligned graded-base InGaAs/InP heterostructure bipolar transistors
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Sulfur and low-temperature SiN_x passivation of self-aligned graded-base InGaAs/InP heterostructure bipolar transistors

机译:自对准梯度基InGaAs / InP异质结构双极晶体管的硫和低温SiN_x钝化

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摘要

The passivation of self-aligned InGaAs/InP heterostructure bipolar transistors (HBTs) with graded base by the combination of S and low-temperature deposited SiN_x was investigated. Base current was found to decrease after the passivation. Collector current significantly increases at low base-emitter voltages. The increase is attributed to the leakage current of the base-collector diode. The current gain was found to increase. When annealing was performed at 300℃ for 5 min, the base current decreases further and the collector current decreases. The leakage of collector current was found to be suppressed. The current gain was further improved and the leakage current can affect the Gummel plots. The leakage source was identified to be the interface between the semiconductor and the SiN_x layer. The leakage current can be decreased by the annealing process.
机译:研究了S和低温沉积SiN_x的结合对具有梯度基极的自对准InGaAs / InP异质结构双极晶体管(HBT)的钝化作用。发现钝化后基极电流减小。在低基极-发射极电压下,集电极电流显着增加。该增加归因于基极-集电极二极管的泄漏电流。发现当前增益增加。在300℃下退火5min,基极电流进一步减小,集电极电流减小。发现集电极电流的泄漏被抑制。电流增益得到进一步改善,泄漏电流会影响Gummel图。泄漏源被确定为半导体和SiN_x层之间的界面。可以通过退火工艺来降低泄漏电流。

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