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首页> 外文期刊>Journal of Thermal Stresses >SIMULATED EFFECTIVE THERMAL CONDUCTIVITY OF SINTERED, RANDOMLY PACKED SPHERES AND STATISTICAL STRUCTURES OF PACKINGS
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SIMULATED EFFECTIVE THERMAL CONDUCTIVITY OF SINTERED, RANDOMLY PACKED SPHERES AND STATISTICAL STRUCTURES OF PACKINGS

机译:烧结,随机包装的球的有效模拟导热率和包装的统计结构

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摘要

Effective thermal conductivity of sintered sperical particles is estimated by a computer simulation. The simulation consists of (i) simulated random packing of equal spheres by a method of "rigid sphere free fall into a virtual box," (ii) finite element method (FEM) estimation of the thermla resistance of a "sintered" pair of spheres, and (iii) simulated heat conduction tests of a "random network," as a model of sintered particles, of thermal resistors with the estimated resitance; these tests yield the effective ocnductivity of sintered spehrical particle aggregates.
机译:通过计算机模拟来估计烧结的多孔颗粒的有效导热率。该模拟包括(i)通过“使球体自由落入虚拟盒子中”的方法对相等球体进行模拟随机填充,(ii)“一对”球体的热阻的有限元方法(FEM)估计(iii)模拟热电阻的“随机网络”(作为烧结颗粒的模型)的导热测试,并具有估计的电阻;这些测试产生了烧结的特殊颗粒聚集体的有效导电性。

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