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Microstructures and macroscopic conductivity of randomly packed and uniaxially pressed sphere compacts

机译:随机堆积和单轴压制球体的微观结构和宏观电导率

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摘要

The present paper deals with simulation of microstructures and macroscopic conductivity of randomly packed, uniaxially pressed andsintered particles. Random packings of identical spheres are constructed by using a sequential deposition method and their microgeometryafter the compaction in sintering is geometrically created by proportional reduction in distances between the sphere centers only inthe vertical direction and by mass addition around overlapped necks. Some of microgeometrical characteristics of the created compactsare statistically examined. Using the data on the packings and geometrical models, macroscopic thermal conductivities of the compactsare estimated. It is found that the conductivities are greatly different from those of simple cubic packings, although both the packingshave almost the same coordination number, and that anisotropy in the conductivity is induced by the compaction in addition to gravity.The conductivities are expressed as a function of the compaction and sintering degrees for practical purposes.
机译:本文研究了随机填充,单轴压制和烧结颗粒的微观结构和宏观电导率的模拟。通过使用顺序沉积方法构造相同球体的无规堆积,并且通过仅在垂​​直方向上按比例减小球体中心之间的距离并通过在重叠的颈部周围进行质量添加来在几何上创建烧结压实后的微观几何形状。对制成的压块的一些微观几何特征进行统计检查。使用填料和几何模型上的数据,可以估算压坯的宏观导热系数。发现电导率与简单立方填料的电导率有很大不同,尽管两种填料的配位数几乎相同,并且除了重力以外,压实还引起电导率的各向异性。电导率表示为实际用途的压实度和烧结度。

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