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首页> 外文期刊>Journal of the IES >Instrument Design for Sub-PPB Oxygenated Contaminants Detection in Semiconductor Processing
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Instrument Design for Sub-PPB Oxygenated Contaminants Detection in Semiconductor Processing

机译:半导体加工中亚PPB含氧污染物检测的仪器设计

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This paper describes a technique for measuring trace quantities of oxygen and moisture contaminants present in a semiconductor and/or containerless processing environment. Monatomic negative oxygen ions, O~-, formed by electron dissociative attachment through interaction with the molecular oxygen and water, are measured to infer the presence of the contaminants. This technique exploits the fact that the cross section for the reaction is greatly enhanced at the resonant energy. The device built to demonstrate this technique combines a small gridded electron ionizer with a conventional mass spectrometer. The concentrations of oxygen have been measured using the method of standard additions by diluting O_2 in N_2. The lowest detection limit obtained was 1.2 kHz (O~-count rate) at a concentration of 10~(-10), corresponding to 0.1 ppb. Sensitivity calculations for detecting moisture, and electron and ion trajectory modeling using the SIMION program are presented. The detection of trace quantities of water vapor was attempted. The difficulties with handling water in the experiments are also described.
机译:本文介绍了一种用于测量半导体和/或无容器加工环境中存在的痕量氧气和水分污染物的技术。通过与分子氧和水的相互作用,通过电子离解性附着形成的单原子负氧离子O〜-可以推断出污染物的存在。该技术利用了这样的事实,即反应的横截面在共振能量处大大增强。为证明该技术而制造的设备将小型栅格化电子电离器与常规质谱仪结合在一起。氧气浓度已通过标准添加方法通过将O_2稀释在N_2中进行测量。在10〜(-10)的浓度下获得的最低检测限为1.2 kHz(计数率),相当于0.1 ppb。提出了用于检测水分的灵敏度计算,以及使用SIMION程序进行的电子和离子轨迹建模。试图检测痕量的水蒸气。还描述了在实验中处理水的困难。

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