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机译:用于航天电子微小型化的薄膜多芯片模块技术的发展
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
HMC Division, Indigenization and Components Group, Reliability and Components Area ISRO Satellite Centre, Bangalore - 560 017, India;
thick film; mcm; microelectronic packaging; micro vias; hmc;
机译:具有激光微宽度的多层厚膜陶瓷用于多层模块
机译:多层先进厚膜多芯片模块技术中嵌入式集总元件的特性与应用
机译:多层先进厚膜多芯片技术技术嵌入式集体元件的特征与应用
机译:使用混合多芯片模块技术的电力电子设备的小型化和封装-下一次电子革命
机译:二氧化钌的微结构发展和电学性质-玻璃厚膜电阻器-非等温研究(混合电路,电陶瓷,微电子学)。
机译:基于一微米厚的稳定钙钛矿薄膜的气固反应用于高效太阳能电池和组件
机译:用于当前空间无线电系统中X波段主动电子扫描阵列的辐射模块的组装技术的开发
机译:用于厚膜微电子和印刷电路板的离子技术和织物