The use of solid-state electronics to replace electromechanical mechanisms in low-power consumer electronics (e.g., cellular telephones, pagers, etc.) has resulted in tremendous improvements in product performance, capability, and reliability. This can be attributed to rapid and novel advances in the semiconductor device and electronic packaging industries. High-power electronic packaging of rectifiers (i.e., ac to dc converters), switching converters (i.e., dc to dc converters), and inverters (i.e., dc to ac converters), for use in the commercial, industrial, military, transportation, electric utility, aerospace, and telecommunication sectors, has recently been initiated but is still in an embryonic stage. This paper documents the development of a universal, scaleable power control device, the Multichip Power Module (MCPM), which delivers high quality, digitally synthesized electric power for multiple applications based on multichip module (MCM) technology. In essence, we are trying to develop a fundamental set of "building blocks" for a "plug-and-play" power electronics system.
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