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Study on sodium and potassium salts of polyacrylic acid as corrosion inhibitors

机译:聚丙烯酸钠钾盐作为缓蚀剂的研究

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The effect of sodium and potassium (20-100 ppm) salts of polyacrylic acid (PAA) was determined on mild steel (MS) and copper (Cu) metals by immersing in Jalgaon ground water for 4-24 h in reflux condition (100℃) and from 5-30 days in ambient condition. The salt deposition on MS and Cu plates was compared with and without polymer addition in water. The salt deposition on MS and Cu increases with increase in time in hot and cold water without addition of polymer. On addition of polymer, with increase in concentration in water, the salt deposition decreases. In cold water on MS, salt deposition is more than Cu, while in hot water it is vice-versa. With increase in the reflux time (4-24 h), salt deposition on Cu and MS increases up to 6 h of reflux time for all concentrations of K salt of PAA and further it decreases from 12 to 24 h. For Na salt of PAA, deposition increases for the lower concentrations (up to 40 ppm), up to 12 h of reflux time and further the deposition decreases for both MS and Cu. At higher concentrations (100 ppm), Na salt of PAA in water is more effective than K salt as the deposition becomes negligible on Cu.
机译:通过在回流条件(100℃)中将其浸入Jalgaon地下水中4-24小时,测定了聚丙烯酸(PAA)的钠盐和钾盐(20-100 ppm)对低碳钢(MS)和铜(Cu)金属的影响),并在环境条件下放置5-30天。比较了在水中是否加入聚合物的情况下,MS和Cu板上的盐沉积情况。在不添加聚合物的情况下,在热水和冷水中,盐在MS和Cu上的沉积随时间的增加而增加。添加聚合物后,随着水中浓度的增加,盐分沉积减少。在MS上的冷水中,盐的沉积量大于Cu,而在热水中则相反。随着回流时间的增加(4-24小时),对于所有浓度的PAA的K盐,在Cu和MS上的盐沉积最多增加6小时的回流时间,并且从12小时减少到24小时。对于PAA的钠盐,在较低浓度(最高40 ppm),回流时间最多12小时时,沉积会增加,而对于MS和Cu而言,沉积都会减少。在较高的浓度(100 ppm)下,水中的PAA的钠盐比钾盐更有效,因为在铜上的沉积变得微不足道。

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