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首页> 外文期刊>Journal of microanolithography, MEMS, and MOEMS >Influence of e-beam aperture angle on critical dimensions-scanning electron microscopes measurements for high aspect ratio structure
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Influence of e-beam aperture angle on critical dimensions-scanning electron microscopes measurements for high aspect ratio structure

机译:电子束孔径角对高长宽比结构的关键尺寸扫描电子显微镜测量的影响

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摘要

The influence of the e-beam aperture angle on the critical dimensions (CD)-scanning electron microscope measurements for a high aspect ratio (AR) structure is investigated. The Monte Carlo simulator JMONSEL is used for evaluating the measurement sensitivity to the variation in the bottom CD. The aperture angle of the primary electron greatly influences the measurement precision of the bottom CD in the high AR structure. Then, we applied an energy-angular selective detection technique to the Monte Carlo simulation results and found that the measurement sensitivity for the large aperture angle was improved. In addition, the experimental results are qualitatively consistent with the results of the Monte Carlo simulation. These results indicate that the energy-angular selective detection technique is effective for improving the measurement resolution of CD at trench bottom of a high AR structure and the technique is also useful for the overlay measurement during after-etch inspection.
机译:研究了电子束孔径角对高长宽比(AR)结构的临界尺寸(CD)-扫描电子显微镜测量的影响。蒙特卡罗模拟器JMONSEL用于评估对底部CD变化的测量灵敏度。初级电子的孔径角极大地影响了高AR结构中底部CD的测量精度。然后,我们将能量角选择性检测技术应用于蒙特卡洛模拟结果,发现对大孔径角的测量灵敏度有所提高。另外,实验结果在质量上与蒙特卡洛模拟的结果一致。这些结果表明,能量角选择性检测技术对于提高高AR结构的沟槽底部的CD的测量分辨率是有效的,并且该技术对于蚀刻后检查期间的重叠测量也是有用的。

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