机译:SN晶须生长的动力学来自Cu衬底的Sn薄膜
Department of Electronics Technology Budapest University of Technology and Economics Budapest Hungary Department of Electrotechnology Czech Technical University in Prague Prague Czech Republic;
Department of Electronics Technology Budapest University of Technology and Economics Budapest Hungary Department of Electrotechnology Czech Technical University in Prague Prague Czech Republic;
Department of Electronics Technology Budapest University of Technology and Economics Budapest Hungary;
Department of Electrotechnology Czech Technical University in Prague Prague Czech Republic;
Department of Electrotechnology Czech Technical University in Prague Prague Czech Republic;
Lukasiewicz Research Network - Institute of Electron Technology Krakow Poland;
机译:Cu,Ni和Fe-42Ni基底上Sn-Ag,Sn-Cu和Sn-Ag-Cu无铅焊料的金属间生长动力学
机译:电沉积在铜基体上的锡膜的微观结构研究:锡晶须和Cu6Sn5沉淀
机译:在等温老化期间,低Ag Sn-0.3Ag-0.7Cu-XMN / Cu焊点界面Cu6Sn5和Cu3Sn5和Cu3Sn层的形态演化与生长动力学
机译:Sn3.5Ag0.9Cu-nanoTiO
机译:两步法制备Cu2ZnSnSe4薄膜太阳能电池。
机译:铜基体粗糙度和锡层厚度对锡薄膜晶须生长的影响
机译:Ni对焊接过程中Cu基底sn-0.7wt。%Cu焊膏中Cu6sn5主要金属间化合物生成和生长的影响
机译:Cu-sn体系相生长动力学及其在复合Nb(3)sn束中的应用