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机译:Sn-58Bi环氧焊点在高速剪切试验下的机械强度和断裂模式转变
Productivity Research Institute, LG Electronics Inc., 19-1, Cheongho-ri, Jinwi-myeon, Pyeongtaek-si, Gyeonggi-do 451-713, Republic of Korea;
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea;
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea;
School of Mechanical Engineering, Chung-Ang University, 221 Heuksuk-dong, Dongjak-gu, Seoul 156-756, Republic of Korea;
School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea;
机译:使用高速球剪切试验评估低银球栅阵列焊点的机械性能
机译:高速球剪切试验评估Sn-3.0A-0.5Cu BGA焊点的力学性能
机译:高速球剪切试验评估Sn-3.0A-0.5Cu BGA焊点的力学性能
机译:高速滚珠剪切/拉动试验中无铅焊球关节强度和断裂能量的比较及其与板级跌落试验的相关性
机译:倒装芯片技术中焊点的可靠性:润湿,界面反应,机械剪切测试和电迁移等基础研究的方法。
机译:通过拓扑优化减少机械和热负荷焊点的剪切应力
机译:重新检查焊球剪切试验以评估机械接头强度