...
首页> 外文期刊>Journal of materials science >Preparation and properties of antioxidative BaO-B_2O_3-SiO_2 glass-coated Cu powder for copper conductive film on LTCC substrate
【24h】

Preparation and properties of antioxidative BaO-B_2O_3-SiO_2 glass-coated Cu powder for copper conductive film on LTCC substrate

机译:LTCC衬底上用于铜导电膜的抗氧化BaO-B_2O_3-SiO_2玻璃包覆铜粉的制备及性能

获取原文
获取原文并翻译 | 示例
           

摘要

AbstractIn this study, uniform BaO–B2O3–SiO2glass coatings on micro Cu powders with different glass/Cu ratio were prepared by sol–gel method. The pastes prepared with the glass-coated Cu powders were screen printed on low temperature co-fired ceramic (LTCC) substrate. Then the dry films on substrate were binder-burned-out at 400 °C in air and co-fired at 910 °C in N2atmosphere. During the binder-burning-out process, the oxidization of the films with 9 and 11 wt% glass was slight because of the improvement of oxidization resistance of the glass-coated Cu powders. Moreover, the sintered film with 9 wt% glass coating showed no crystal phase of copper oxide and had small sheet resistance of 1.3 mΩ/□, which can be used as good conductive thick film on LTCC substrate for microelectronic packaging.
机译: 摘要 在本研究中,统一的BaO–B 2 O 3采用溶胶-凝胶法在不同Cu / Cu比的微细铜粉上制备了 -SiO 2 玻璃涂层。将用玻璃涂覆的铜粉制备的糊剂丝网印刷在低温共烧陶瓷(LTCC)基板上。然后将基材上的干膜在空气中于400°C烧掉粘合剂,并在N 2 大气中于910°C共烧。在粘合剂烧尽过程中,由于提高了玻璃涂层铜粉的抗氧化性,含9和11重量%玻璃的薄膜的氧化程度很小。而且,具有9wt%玻璃涂层的烧结膜没有氧化铜的结晶相,并且具有1.3mΩ/□的小薄层电阻,可以用作用于微电子封装的LTCC衬底上的良好导电厚膜。 < /摘要>

著录项

  • 来源
    《Journal of materials science》 |2018年第1期|130-137|共8页
  • 作者单位

    Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering of Tianjin University;

    Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering of Tianjin University;

    Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering of Tianjin University;

    Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering of Tianjin University;

    National Key Laboratory of Application Specific Integrated Circuit, Hebei Semiconductor Research Institute;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号