机译:氧化石墨烯对无铅焊点电迁移寿命的影响
Korea Inst Ind Technol KITECH, Joining R&D Grp, 156 Gaetbeol Ro, Incheon 21999, South Korea|Korea Adv Inst Sci & Technol, Dept Mech Engn, 291 Daehak Ro, Daejeon 34141, South Korea;
Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea;
Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea;
Andong Natl Univ, Sch Mat Sci & Engn, 1375 Gyeongdong Ro, Andong Si 36729, Gyeongsangbuk D, South Korea;
Korea Inst Ind Technol KITECH, Joining R&D Grp, 156 Gaetbeol Ro, Incheon 21999, South Korea;
Korea Inst Ind Technol KITECH, Joining R&D Grp, 156 Gaetbeol Ro, Incheon 21999, South Korea;
Korea Adv Inst Sci & Technol, Dept Mech Engn, 291 Daehak Ro, Daejeon 34141, South Korea;
机译:无铅焊点中的电流拥挤及其对电迁移和界面反应的影响
机译:电迁移对无铅焊点中Cu-Sn金属间化合物生长动力学的影响
机译:晶界错位对无铅焊点电迁移的影响
机译:模拟微结构对无铅焊点中电迁移的影响
机译:无铅倒装芯片焊点中电迁移引起的失效的统计和物理分析
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:无铅焊点的数值分析:热循环和电迁移的影响