The mechanical deformation of crystalline silicon induced by micro-indentation has been studied. Indentations were made using a variety of loading conditions. The effects on the final deformation microstructure of the load-unload rates and both spherical and pointed (Berkovich) indenters were investigated at maximum loads of up to 250 mN. The mechanically deformed regions were then examined using cross-sectional Transmission electron microscopy (XTEM), Raman spectroscopy, and atomic force Microscopy. High-pressure phases (Si-XII) and Si-III) and amorphous silicon have been Identified in the deformation microstructure of both pointed and spherical indentations.
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