首页> 外国专利> METHOD OF EPITAXIAL GROWTH OF INTERFACE BETWEEN MATERIALS FROM III-V GROUPS AND SILICON PLATE, WHICH PROVIDES NEUTRALIZATION OF RESIDUAL DEFORMATIONS

METHOD OF EPITAXIAL GROWTH OF INTERFACE BETWEEN MATERIALS FROM III-V GROUPS AND SILICON PLATE, WHICH PROVIDES NEUTRALIZATION OF RESIDUAL DEFORMATIONS

机译:提供残余变形中和的III-V族材料与硅板之间界面的表层生长方法

摘要

FIELD: chemistry.;SUBSTANCE: invention relates to a method of making semiconductor materials containing boundary layers between materials from III-V groups and Si substrate. Invention relates to a method of making semiconductor materials containing GaAs in combination with Si(111) substrates, wherein residual deformation caused by different coefficients of thermal expansion of corresponding materials, is neutralized by adding an additional layer(s) that compensates for residual deformation. Thus, in the disclosed method of epitaxial growth on Si(111) plate, forming a first layer of material III-V with a first constant of the crystal lattice, and then second layer of material III-V from second constant of crystal lattice, wherein the second constant of the crystal lattice is less than the first constant of the crystal lattice.;EFFECT: method provides neutralization of residual deformation in semiconductor materials.;15 cl, 13 dwg
机译:半导体材料的制造方法技术领域本发明涉及一种制造包含III-V族材料与Si衬底之间的边界层的半导体材料的方法。本发明涉及一种制造与Si(111)衬底组合的包含GaAs的半导体材料的方法,其中通过添加补偿残余变形的附加层来抵消由相应材料的不同热膨胀系数引起的残余变形。因此,在所公开的在Si(111)板上外延生长的方法中,形成具有晶格的第一常数的材料III-V的第一层,然后从晶格的第二常数形成材料III-V的第二层,其中,晶格的第二常数小于晶格的第一常数。效果:该方法可以中和半导体材料中的残余变形。15 cl,13 dwg

著录项

  • 公开/公告号RU2696352C2

    专利类型

  • 公开/公告日2019-08-01

    原文格式PDF

  • 申请/专利权人 INTEGRATED SOLAR;

    申请/专利号RU20170126041

  • 发明设计人 BUGGE RENATO (NO);MYRVAGNES GEIR (NO);

    申请日2015-12-23

  • 分类号H01L21/20;H01L31/0304;

  • 国家 RU

  • 入库时间 2022-08-21 11:46:07

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