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Selective growth and kinetic study of copper oxide nanowires from patterned thin-film multilayer structures

机译:图案化薄膜多层结构对氧化铜纳米线的选择性生长和动力学研究

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摘要

Selective growth of CuO nanowires on the etched face of Al_2O_3/Cu/Al_2O_3 thin-film multilayer patterns was achieved by ambient oxidation at 400℃. The nanowires were observed to selectively grow only from the pattern edge with diameter limited by the thickness of Cu thin film. Transmission-electron-microscopy (TEM) characterization confirmed CuO nanowires of a monoclinic CuO growing in the [010] crystallographic direction. Nanowire growth kinetics was studied at 400℃ for different cumulative growth durations with initial growth rates of ~ 1 nm/min. A base growth mechanism with kinetics limited by oxygen diffusion through defects of a scaling oxide film is consistent with observed kinetics. The oxygen diffusivity is found to be ~ 10~(-11) cm~2/s, consistent with the grain-boundary diffusion of oxygen through polycrystalline copper oxide.
机译:通过在400℃下进行环境氧化,在Al_2O_3 / Cu / Al_2O_3薄膜多层图案的刻蚀面上实现了CuO纳米线的选择性生长。观察到纳米线仅从图案边缘选择性生长,其直径受Cu薄膜的厚度限制。透射电子显微镜(TEM)表征证实了单斜晶CuO在[010]晶体学方向上生长的CuO纳米线。在400℃下,以不同的累积生长时间对纳米线的生长动力学进行了研究,初始生长速率约为1 nm / min。基本生长机理的动力学受氧扩散通过氧化皮膜缺陷的扩散所限制,与观察到的动力学一致。发现氧的扩散率为〜10〜(-11)cm〜2 / s,与氧通过多晶氧化铜的晶界扩散一致。

著录项

  • 来源
    《Journal of Materials Research 》 |2007年第10期| 2691-2699| 共9页
  • 作者单位

    Chemical and Materials Engineering Department, University of Kentucky, Lexington, Kentucky 40506;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学 ;
  • 关键词

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