Enhanced Boiling of FC-72 on Silicon Chips With Micro-Pin-Fins And Submicron-Scale roughness

摘要

Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60 μm~3 (width ×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip (10×10×0.5 mm~3) by use of microelectronic fabrication techniques. Experiments were conducted at the liquid sub- coolings of 0, 3, 25, and 45 K.