Patent Issued for Method and Composition for Electrodeposition of Copper in Microelectronics with Dipyridyl-Based Levelers

摘要

2013 MAR 20 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering -- FromnAlexandria, Virginia, VerticalNews journalists report that a patent by the inventors Paneccasio, Jr.,nVincent (Madison, CT); Lin, Xuan (Northford, CT); Hurtubise, Richard (Clinton, CT); Chen, Qingyunn(Branford, CT), filed on November 26, 2008, was cleared and issued on March 5, 2013.