New Technology Makes Compact PWBs

摘要

Dai Nippon Printing Co., Ltd. (DNP) has developed one of the world's slimmest printed wiring boards (PWBs) with embedded ICs and passive components, such as capacitors and resistors. In developing the component-embedded PWB, DNP has employed the company's proprietary manufacturing technology called Buried Bump Interconnection Technology (B2it), and improved the board and wiring materials, thereby successfully reducing the thickness of the PWB by about 15 percent, from 0.45mm of the company's previous products to 0.38mm. Sample shipment of the product started in January.