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机译:应变速率下焊料/铜界面行为的研究
Department of Mechanical and Aerospace Engineering, Naval Postgraduate School, Monterey, CA 93943;
Department of Mechanical and Aerospace Engineering, Naval Postgraduate School, Monterey, CA 93943;
Department of Mechanical and Aerospace Engineering, Naval Postgraduate School, Monterey, CA 93943;
Department of Mechanical and Aerospace Engineering, Naval Postgraduate School, Monterey, CA 93943;
lead-free solder; interface failure; nonuniform strain rate;
机译:球栅阵列锡银铜焊料/纯铜焊盘接头界面上的剪切断裂行为
机译:高应变速率下含铅和无铅焊料的拉伸行为
机译:倒装芯片封装中焊点和界面处应变行为的数值分析
机译:SAC305无铅焊料的循环应力-应变行为:时效,温度,应变速率和塑性应变范围的影响
机译:使用先前建立的材料模型,通过改变焊料量,间距和热范围,研究威布尔分布的使用以及无铅焊料在加速热循环中的可靠性是否符合要求。
机译:固化时间对不同应变率加载SLA印刷样品强度行为的实验研究
机译:应变速率下焊料/铜界面的实验研究