机译:非密封光电封装中水分引起的环氧溶胀的实验和计算研究
Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902;
Integrated Electronics Engineering Center (IEEC), State University of New York at Binghamton, Binghamton, NY 13902;
Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902;
coefficient of hygroscopic swelling (CHS); digital image correlation; temperature dependence of CHS; moisture concentration dependence of CHS; moisture stress analysis;
机译:LED包装中有机硅/磷复合膜和环氧模塑复合物的吸湿和吸湿膨胀的原位表征
机译:水分和温度引起的软木和硬木胶合层和LVL的膨胀/收缩:实验研究
机译:软水和温度诱导软木和硬木Glulam和LVL的膨胀/收缩:实验研究
机译:电子包装用环氧模塑化合物的水分吸收和吸湿膨胀的原位表征
机译:非密封光电封装中选定故障机制的研究
机译:使用内部应力概念来评估水分吸附引起的通过玻璃HPMC薄膜传输的水分膨胀的重要性
机译:不同pH介质涂层黄麻 - 环氧复合材料吸湿性的实验研究