机译:混合纳米复合材料热界面材料:导热系数和填料密度
Department of Mechanical Engineering Institute for Materials Research Binghamton University;
Department of Mechanical Engineering Institute for Materials Research Binghamton University;
School of Materials Science andEnergy Engineering Foshan University;
Department of Mechanical Engineering Institute for Materials Research Binghamton University Department of MaterialsScience and Engineering University of Maryland;
Density; Copper; Particulate matter; Packing (Shipments); Packings (Cushioning); Thermal conductivity; Nanocomposites; Fillers (Materials); Silver; Solders; Nanoparticles; Temperature; Manufacturing; Microparticles; Compression; Composite materials; Steady state;
机译:界面密度,质量和周期对纳米复合材料晶格热导率的影响
机译:热导率术语中具有石墨烯热界面材料的CNT热界面材料的比较
机译:有机-无机界面的导热系数评估以及界面对复合材料导热系数的影响
机译:石墨烯界面材料的界面热阻和面内电导率表征的两步拉曼方法
机译:声子和电子是平均自由路径依赖性对晶体材料的热导率的贡献和金属合金电介质界面的热界面电导
机译:MWCNT或具有改进的热氧化稳定性的MWCNT或杂化MWCNT /石墨烯纳米片增强的导电和导热低密度聚乙烯基纳米复合材料
机译:用混合密度函数理论研究的NaCOO2和LiCoO2嵌入材料的晶格导热系数