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首页> 外文期刊>Journal of Crystal Growth >Effect of UV-O_2, NF_3/H_2 surface preparation on the crystalline defects in silicon homoepitaxy (Part I. A study on photochemical surface preparation in series)
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Effect of UV-O_2, NF_3/H_2 surface preparation on the crystalline defects in silicon homoepitaxy (Part I. A study on photochemical surface preparation in series)

机译:UV-O_2,NF_3 / H_2表面制备对硅同质外延晶体缺陷的影响(第一部分,光化学表面制备系列研究)

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摘要

In this work, the organic residue and oxide on silicon wafer were treated with UV-excited oxygen and trifluoronitrogen gases as a pre-treatment for silicon homoepitaxy. A typical positive photo resist, AZ 1512, was coated as a model organic residue. UV-O_2 cleaning (UVOC) and UV-NF_3/H_2 treatment removed the organic residue and native oxide layer, respectively, for silicon epitaxial growth. A study of removal rate showed that the processing temperature is a more critical process parameter than pressure. Besides, hydrogen dilution improves the surface roughness of UV-NF_3-treated surface as shown in the atomic force microscope images.
机译:在这项工作中,硅片上的有机残留物和氧化物用紫外线激发的氧气和三氟氮气体处理,作为硅均质外延的预处理。将典型的正型光刻胶AZ 1512涂覆为模型有机残留物。 UV-O_2清洗(UVOC)和UV-NF_3 / H_2处理分别去除了有机残留物和天然氧化物层,以进行硅外延生长。对去除率的研究表明,加工温度是比压力更关键的工艺参数。此外,如原子力显微镜图像所示,氢稀释可改善经UV-NF_3处理的表面的表面粗糙度。

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