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Metalorganic vapor-phase epitaxy of GaN from trimethylgallium and tertiarybutylhydrazine

机译:三甲基镓和叔丁基肼对GaN的金属有机气相外延

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Gallium nitride (GaN) layers have been epitaxially grown by the metalorganic vapor-phase epitaxy technique using trimethylgallium (TMG) and tertiarybutylhydrazine (TBHy) as the reactants at temperatures ranging from 923 to 958 K and a low pressure of 10 Torr. A film growth model based on the Langmuir-Hinshelwood-type reaction is established to describe the growth behavior of GaN from TMG and TBHy. By model fitting, the experimental growth rate data, the adsorption equilibrium constant of TBHy is found to be 1/7 that of TMG at the above temperature range, indicating the possibility to obtain stoichiometric GaN films at quite small V/III precursor feed ratios. Additionally, a comparison of the carbon incorporation when dimethylhydrazine (DMHy) is used as the nitrogen source is also made. The result shows that the films formed using TBHy have much less carbon content than those formed using DMHy. The β-hydride elimination in the t-butyl ligand of TBHy occurs to form a stable hydrocarbon species, thus taking away the carbon contaminants might explain this phenomenon.
机译:氮化镓(GaN)层已通过金属有机气相外延技术在923至958 K的温度和10托的低压下使用三甲基镓(TMG)和叔丁基肼(TBHy)作为反应物外延生长。建立了基于Langmuir-Hinshelwood型反应的薄膜生长模型,以描述TMG和TBHy对GaN的生长行为。通过模型拟合,实验生长速率数据,发现在上述温度范围内TBHy的吸附平衡常数为TMG的1/7,这表明有可能以非常小的V / III前驱体进料比获得化学计量的GaN膜。另外,还比较了使用二甲基肼(DMHy)作为氮源时的碳掺入。结果表明,与使用DMHy形成的薄膜相比,使用TBHy形成的薄膜具有更低的碳含量。发生在TBHy的叔丁基配体中的β-氢化物消除形成了稳定的烃类,因此带走碳污染物可能解释了这种现象。

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