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首页> 外文期刊>Journal of Crystal Growth >A simple approach to temperature dependence of strain energy: Application to GaN-based semiconductors
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A simple approach to temperature dependence of strain energy: Application to GaN-based semiconductors

机译:一种简单的应变能温度依赖性方法:应用于GaN基半导体

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We propose a simple approach to temperature dependence of the strain energy in epitaxial thin films coherently grown on the substrate and apply it to the stability for GaN-based semiconductors. The strain energy is simply described as a function of the bulk modulus and lattice parameters using the continuum elasticity theory. Based on this formula, the temperature dependence of the strain energy is estimated using Mie-Grueneisen equation of state that gives temperature dependence of the bulk modulus and lattice parameter. The versatility of the strain energy formula is confirmed by comparing the calculated strain energy for GaN with that obtained by our empirical potential calculations at 0 K. We also compare the temperature dependence of the bulk modulus and lattice parameter for GaN with experimental results at high temperatures. The calculated results imply that the elastic constants decrease while the lattice parameter increases with increase of temperature. They are consistent with experimental results. Using these calculated results, it is clarified that the strain energy accumulated in zinc blende structured (ZB) GaN coherently grown on ZB-SiC(001)at 1000 K becomes ~10% greater than that at 0 K. This gives smaller critical film thickness of misfit dislocation generation at high temperatures.
机译:我们提出了一种简单的方法来解决在衬底上相干生长的外延薄膜中应变能的温度依赖性,并将其应用于基于GaN的半导体的稳定性。使用连续弹性理论,将应变能简单描述为体积模量和晶格参数的函数。基于该公式,使用Mie-Grueneisen状态方程估算应变能的温度依赖性,该方程给出了体积模量和晶格参数的温度依赖性。通过将GaN的计算应变能与通过我们在0 K下的经验势能计算获得的应变能进行比较,可以确认应变能公式的通用性。我们还将GaN的体积模量和晶格参数的温度依赖性与高温下的实验结果进行比较。计算结果表明,随着温度的升高,弹性常数减小,而晶格参数增大。它们与实验结果一致。使用这些计算结果可以说明,在1000 K下相干生长在ZB-SiC(001)上的锌混合结构(ZB)GaN中累积的应变能比在0 K时大〜10%。这使得临界膜厚度更小高温下错配位错的产生。

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