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High-performance III-nitride blue LEDs grown and fabricated on patterned Si substrates

机译:在图案化的Si基板上生长和制造的高性能III型氮化物蓝光LED

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摘要

InGaN/GaN based blue LEDs with 2-μm-thick crack-free GaN buffer layers were successfully grown and fabricated on patterned Si (111) substrates. The patterns on the substrates include 340 μm x 340 μm square islands, separated by 3-μm deep and 20 蘭 wide trenches, along the < 110 > and < 112 > crystalline orientations. In addition to using the patterned growth technique, thin AlN and SiN_x interlayers grown at high temperatures were also employed to partially release the residual stress and to further improve the crystalline quality. Blue LEDs of 300 x 300 μm~2 fabricated on the islands, without thinning and packaging, exhibited a high output power of around 0.7mW at a drive current of 20mA. Compared to III-nitride LEDs grown on sapphire substrates, the same LED structures grown on patterned Si substrates showed a few nm of red shift in emitting wavelength, suggesting some residual stress of GaN on patterned Si.
机译:具有2μm厚的无裂纹GaN缓冲层的InGaN / GaN基蓝色LED已成功生长并制造在图案化的Si(111)衬底上。基板上的图案包括340μmx 340μm的方形岛,沿着<110>和<112>晶向被3 µm深的沟槽和20兰宽的沟槽隔开。除了使用图案化生长技术以外,还采用在高温下生长的薄AlN和SiN_x中间层来部分释放残余应力并进一步提高晶体质量。在岛上制造的300 x 300μm〜2的蓝色LED无需薄化和封装,在20mA的驱动电流下表现出约0.7mW的高输出功率。与在蓝宝石衬底上生长的III族氮化物LED相比,在有图案的Si衬底上生长的相同LED结构在发射波长上显示出几纳米的红移,这表明在有图案的Si上GaN会有一些残余应力。

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