首页> 外文期刊>Journal of Crystal Growth >Analysis Of Germanium Epiready Wafers For Ⅲ-Ⅴ Heteroepitaxy
【24h】

Analysis Of Germanium Epiready Wafers For Ⅲ-Ⅴ Heteroepitaxy

机译:Ⅲ-Ⅴ族异质外延的锗外延晶片的分析

获取原文
获取原文并翻译 | 示例
           

摘要

Frequently, when growing Ⅲ-Ⅴ semiconductors on germanium substrates, unexpected differences between nominally identical substrates are encountered. Using atomic force microscopy (AFM), we have analysed a set of germanium substrates sharing the same specifications. The substrates come from the same vendor but different results come about in terms of the morphology of the epilayers produced by the same epitaxial routine (i.e. substrate W1 produced epilayers with good morphology while substrate WX produced epilayers with defects). The morphological analysis has been carried out on (a) epiready substrates; (b) samples after a high-temperature bake at 700℃; and (c) on the samples after a hydride (PH_3) annealing at 640℃. In the two first stages all substrates (both W1 and WX) show the same good morphology with RMS roughness below 3 A in all cases. It is in the third stage (annealing in PH_3) that the morphology degrades and the differences between the samples become apparent. After phosphine exposure at 640℃, the RMS roughness of both substrates approximately doubles, and their surface appears as full of peaks and valleys on the nanometre scale. Despite the general appearance of the samples being similar, a careful analysis of their surface reveals that the substrates that produce bad morphologies (WX) show higher peaks, and some of their roughness parameters, namely, surface kurtosis and the surface skewness, are considerably degraded.
机译:通常,在锗衬底上生长Ⅲ-Ⅴ型半导体时,在名义上相同的衬底之间会遇到意想不到的差异。使用原子力显微镜(AFM),我们分析了一组具有相同规格的锗基板。衬底来自相同的供应商,但是在通过相同的外延程序产生的外延层的形态方面得到不同的结果(即衬底W1产生具有良好形态的外延层,而衬底WX产生具有缺陷的外延层)。形态分析已在(a)外延基质上进行; (b)在700℃高温烘烤后的样品; (c)氢化物(PH_3)在640℃退火后的样品。在前两个阶段中,所有基板(W1和WX)均显示出相同的良好形态,所有情况下RMS粗糙度均低于3A。在第三阶段(在PH_3中退火),形态降低,样品之间的差异变得明显。在640℃暴露于磷化氢后,两个基板的RMS粗糙度大约翻倍,并且它们的表面在纳米级上看起来充满了峰谷。尽管样品的总体外观相似,但仔细分析其表面后发现,产生不良形貌(WX)的基材显示出较高的峰,并且其某些粗糙度参数(即表面峰度和表面偏斜度)大大降低了。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号