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Effect of substrates on morphoogical evolution of a film in the silicon CVD process: approach by charged cluster model

机译:衬底对硅CVD工艺中薄膜形态演化的影响:带电簇模型方法

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摘要

Film morphology depends on the types of substrate used in the CVD process. This dependency has been studied based on the charged cluster modelin the silicon CVD process. Three exists a strong correlation between microstructure evolution and the charge transfer rate (CTR) of substrate materials. Films tended to be porous on substrates with a high CTR and dense onsubstrates with low CTR. The microstructure evolution could be explained by the interaction of charged clusters with the substrate.
机译:膜的形态取决于CVD工艺中所用基材的类型。已经基于硅CVD工艺中的带电团簇模型研究了这种依赖性。三者之间在微观结构演变和基板材料的电荷转移率(CTR)之间存在很强的相关性。薄膜在高点击率的基材上往往是多孔的,而在低点击率的基材上往往是致密的。微观结构的演化可以通过带电团簇与基底的相互作用来解释。

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