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Tetrahedral elements in self-consistent parallel 3D Monte Carlo simulations of MOSFETs

机译:MOSFET的自洽并行3D蒙特卡洛模拟中的四面体元素

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摘要

Novel thin-body architectures with complex geometry are becoming of large interest because they are expected to deliver the ITRS prescribed on-current when semiconductor transistors are scaled into nanometer dimensions. We report on the development of a 3D parallel Monte Carlo simulator coupled to a finite element solver for the Pois-son equation in order to correctly describe the complex domains of advanced FinFET transistors. We study issues such as charge assignment, field calculation, treatment of contacts and parallelisation approach which have to be taken into account when using tetrahedral elements. The applicability of the simulator is demonstrated by modelling a 10 nm gate length double gate MOSFET with a body thickness of 6.1 nm.
机译:具有复杂几何形状的新型薄体架构正引起人们的极大兴趣,因为当半导体晶体管被缩放到纳米尺寸时,它们有望提供ITRS规定的导通电流。我们报告3D并行蒙特卡罗仿真器的发展,该仿真器耦合到Pois-son方程的有限元求解器,以便正确描述高级FinFET晶体管的复杂域。我们研究使用四面体元素时必须考虑的问题,例如电荷分配,场计算,触点处理和并行化方法。仿真器的适用性是通过对10 nm栅极长度,厚度为6.1 nm的双栅极MOSFET建模来证明的。

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