首页> 外文期刊>Journal of Applied Physics >Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction
【24h】

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

机译:液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

The interfacial intermetallic compound (IMC) formation between Cu substrate and Sn-3.8Ag-0.7Cu-X (wt.%) solder alloys has been studied, where X consists of 0–5% Zn or 0–2% Al. The study has focused on the effect of solder volume as well as the Zn or Al concentration. With low solder volume, when the Zn and Al concentrations in the solder are also low, the initial Cu-Zn and Al-Cu IMC layers, which form at the solder/substrate interface, are not stable and spall off, displaced by a Cu6Sn5 IMC layer. As the total Zn or Al content in the system increases by increasing solder volume, stable CuZn or Al2Cu IMCs form on the substrate and are not displaced. Increasing concentration of Zn has a similar effect of stabilizing the Cu-Zn IMC layer and also of forming a stable Cu5Zn8 layer, but increasing Al concentration alone does not prevent spalling of Al2Cu. These results are explained using a combination of thermodynamic- and kinetics-based arguments.
机译:已经研究了在铜基体和Sn-3.8Ag-0.7Cu-X(wt。%)焊料合金之间形成界面金属间化合物(IMC),其中X由0-5%的Zn或0-2%的Al组成。该研究集中在焊料量以及锌或铝浓度的影响上。在低焊料量的情况下,当焊料中的Zn和Al浓度也很低时,在焊料/基板界面处形成的初始Cu-Zn和Al-Cu IMC层将不稳定并剥落,并被Cu6Sn5取代IMC层。随着系统中总的Zn或Al含量通过增加焊料量而增加,稳定的CuZn或Al2Cu IMC在基板上形成并且不会被置换。增加Zn的浓度具有稳定Cu-Zn IMC层和形成稳定的Cu5Zn8层的相似效果,但是仅增加Al的浓度并不能防止Al2Cu剥落。结合使用基于热力学和动力学的论据来解释这些结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号