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Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

机译：液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落

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Kotadia H. R.; Panneerselvam A.; Mokhtari O.; Green M. A.; Mannan S. H.;
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年度 2012
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正文语种 eng
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1. Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction [J] . Kotadia H. R., Panneerselvam A., Mokhtari O., Journal of Applied Physics . 2012,第7期

机译：液相反应过程中焊料与Cu衬底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落
2. Massive spalling of Cu-Zn and Cu-AI intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction [J] . H. R. Kotadia, A. Panneerselvam, O. Mokhtari, Journal of Applied Physics . 2012,第7pta1期

机译：液相反应过程中焊料与Cu基底之间的界面处Cu-Zn和Cu-Al金属间化合物大量剥落
3. Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates [J] . YOUNG MIN KIM, HEE-RA ROH, SUNGTAE KIM, Journal of Electronic Materials . 2010,第12期

机译：Sn-3.0Ag-0.5Cu焊料与Cu-Zn合金基底之间界面处金属间化合物形成的动力学
4. Intermetallic compound formation and solder joint reliability of Sn-Ag-Cu solder ball on Cu-Zn substrate [C] . Hee-Ra Roh, Young-Ho Kim 2007 international conference on electronic materials and packaging . 2007

机译：Cu-Zn基体上Sn-Ag-Cu焊球的金属间化合物形成和焊点可靠性
5. Orientation distribution, morphology, and size distribution of copper-tin intermetallic compound in reactions between molten solder and copper in flip chip solder joints. [D] . Suh, Jongook. 2006

机译：倒装芯片焊点中熔融焊料与铜之间的反应中铜锡金属间化合物的方向分布，形态和尺寸分布。
6. Suppressed Growth of (Fe Cr Co Ni Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging [O] . Yu-An Shen, Chun-Ming Lin, Jiahui Li, -1

机译：固态时效期间Sn-3.0Ag-0.5Cu焊料与FeCoNiCrCu0.5衬底之间的界面处（FeCrCoNiCu）Sn2金属间化合物的生长受到抑制
7. Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate [O] . M. H. Tsai, A Y. W. Lin, H. Y. Chuang, 2009

机译：sn浓度对Cu基底高pb焊接反应中大块剥落的影响
8. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging [R] . Minor, A. M. , Morris, J. W. 1999

机译：老化后在焊料 - 基板界面上生长au-Ni-sn金属间化合物

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

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