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Copper alloys for suppressing growth of Cu-Al intermetallic compounds
Copper alloys for suppressing growth of Cu-Al intermetallic compounds
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机译:抑制铜铝金属间化合物生长的铜合金
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摘要
Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds. The copper alloys of the instant invention have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes.
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