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Transport properties of undoped and NH_(3)-doped polycrystalline SnO_(2) with low background electron concentrations

机译:低背景电子浓度的未掺杂和NH_(3)掺杂的多晶SnO_(2)的输运性质

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A series of polycrystalline 1 μm thick SnO_(2) films were deposited onto borosilicate glass substrates by atmospheric pressure chemical vapor deposition. Unintentionally doped as-grown SnO_(2) layers had electron concentrations and mobility of 2-4×10~(17) cm~(-3) and 25-30 cm~(2)/V s, respectively. Potential barriers and trap concentrations were calculated to be 30 meV and 2.3×10~(12) cm~(-2), respectively. Upon N_(2)/vacuum annealing at 670 K for 15-20 min, the potential barrier height decreased to 8 meV and the electron mobility increased to 58 cm~(2)/V s. When doped with ammonia, the mobility of as-grown samples decreased to 0.5 cm~(2)/V s. The magnitude of the potential barriers varied, with ammonia doping, from 175 to 31 meV with trap densities of 4.7-1.2×10~(12) cm~(-3), respectively. Upon vacuum/N_(2) annealing at 670 K for 20 min, the electron mobilities of ammonia doped films recovered to 50-71 cm~(2)/V s, whereas the height of the potential barriers decreased to 3-4 meV with trap concentrations of 8-9×10~(11) cm~(-2). The observed changes in the electrical properties are well described by a double back-to-back Schottky barrier model.
机译:通过大气压化学气相沉积将一系列多晶1μm厚的SnO_(2)薄膜沉积到硼硅玻璃基板上。意外掺杂的SnO_(2)层的电子浓度和迁移率分别为2-4×10〜(17)cm〜(-3)和25-30 cm〜(2)/ V s。计算出的势垒和陷阱浓度分别为30 meV和2.3×10〜(12)cm〜(-2)。 N_(2)/真空在670 K下退火15-20 min后,势垒高度降低到8 meV,电子迁移率增加到58 cm〜(2)/ V s。当掺入氨水时,样品的迁移率降低到0.5 cm〜(2)/ V s。随着氨的掺杂,势垒的大小从175到31 meV变化,陷阱密度分别为4.7-1.2×10〜(12)cm〜(-3)。真空/ N_(2)在670 K下退火20分钟后,氨掺杂薄膜的电子迁移率恢复到50-71 cm〜(2)/ V s,而势垒层的高度降低到3-4 meV。阱浓度为8-9×10〜(11)cm〜(-2)。双重背对背肖特基势垒模型很好地描述了观察到的电性能变化。

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