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首页> 外文期刊>Journal of Applied Physics >Influence of pulse duration on the plasma characteristics in high-power pulsed magnetron discharges
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Influence of pulse duration on the plasma characteristics in high-power pulsed magnetron discharges

机译:脉冲持续时间对大功率脉冲磁控管放电等离子体特性的影响

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摘要

High-power pulsed magnetron discharges have drawn an increasing interest as an approach to produce highly ionized metallic vapor. In this paper we propose to study how the plasma composition and the deposition rate are influenced by the pulse duration. The plasma is studied by time-resolved optical emission and absorption spectroscopies and the deposition rate is controlled thanks to a quartz microbalance. The pulse length is varied between 2.5 and 20 μs at 2 and 10 mTorr in pure argon. The sputtered material is titanium. For a constant discharge power, the deposition rate increases as the pulse length decreases. With 5 μs pulse, for an average power of 300 W, the deposition rate is ~70% of the deposition rate obtained in direct current magnetron sputtering at the same power. The increase of deposition rate can be related to the sputtering regime. For long pulses, self-sputtering seems to occur as demonstrated by time-resolved optical emission diagnostic of the discharge. In contrary, the metallic vapor ionization rate, as determined by absorption measurements, diminishes as the pulses are shortened. Nevertheless, the ionization rate is in the range of 50% for 5 μs pulses while it lies below 10% in the case of a classical continuous magnetron discharge.
机译:作为产生高度电离的金属蒸气的方法,大功率脉冲磁控管放电引起了越来越多的兴趣。在本文中,我们建议研究脉冲持续时间如何影响等离子体组成和沉积速率。通过时间分辨的光发射和吸收光谱学研究等离子体,并借助石英微量天平控制沉积速率。在纯氩气中,脉冲长度在2和10 mTorr时在2.5和20μs之间变化。溅射材料是钛。对于恒定的放电功率,沉积速率随着脉冲长度的减小而增加。在5μs的脉冲下,平均功率为300 W,沉积速率约为在相同功率下的直流磁控溅射沉积速率的70%。沉积速率的增加可能与溅射方式有关。对于长脉冲,自放电似乎会发生,如时间分辨光发射诊断所证明的那样。相反,通过吸收测量确定的金属蒸气电离率随着脉冲的缩短而减小。然而,对于5μs脉冲,电离率在50%的范围内,而在传统的连续磁控管放电情况下,电离率在10%以下。

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