Welding-wettability enhancement of Sn-Pb solder on AZ31 Mg alloys using high-power pulsed magnetron discharge plasma ion implantation

摘要

Magnesium alloy is difficult to be directly brazed and a copper film has been fabricated to achieve the welding wettability. The high-power pulsed magnetron discharge plasma ion implantation has been utilized to fabricate the copper layer on AZ31 alloys. The interface between the film and substrate were investigated using scanning electron microscope(SEM) with EDS analysis. The thickness of the films fabricated at different implantation and deposition time was studied by SEM. The wettability of Sn-Pb solder on the modified Mg alloys has been paid more attention. The results show composition transition zones for thickness of about 1祄 are observed at the interface because of prior -15kV Cu ion implantation for 30min. This may make the thin films adhere firmly to the substrate. With increasing the deposition time,the wettability of the Sn-Pb solder on the modified Mg alloys is improved due to a larger film thickness. There exists a critical film thickness (3 祄),beyond which the Sn-Pb solder can completely wet on the modified Mg alloys. Our results have confirmed that the novel technique is suitable for brazing the materials difficult to be brazed in a common manner.