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首页> 外文期刊>Journal of Applied Physics >Ultrathin amorphous Si layer for the growth of strain relaxed Si_(0.75)Ge_(0.25) alloy layer
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Ultrathin amorphous Si layer for the growth of strain relaxed Si_(0.75)Ge_(0.25) alloy layer

机译:超薄非晶硅层,用于应变松弛Si_(0.75)Ge_(0.25)合金层的生长

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摘要

We propose a method for the growth of strain relaxed and smooth Si_(0.75)Ge_(0.25) alloy layers on a Si(001) substrate. In this method, we have used an ultrathin amorphous Si (UTA-Si) layer as a buffer layer and implemented a two-step process to grow the top alloy layer. High-resolution x-ray diffraction studies show that the alloy layers are highly relaxed. Topographic studies by contact mode atomic force microscopy show that the surfaces are very smooth. UTA-Si works as a strain adjuster and helps to reduce residual strain introducing dislocation in the buffer and substrate regions. However, it was observed that the residual strain and the surface morphology depend on the thickness of the UTA-Si buffer layers and also on the growth mode of the alloy layer.
机译:我们提出了一种在Si(001)衬底上生长应变松弛且光滑的Si_(0.75)Ge_(0.25)合金层的方法。在这种方法中,我们使用了超薄非晶硅(UTA-Si)层作为缓冲层,并实施了两步工艺来生长顶部合金层。高分辨率X射线衍射研究表明,合金层高度松弛。通过接触模式原子力显微镜进行的地形研究表明,表面非常光滑。 UTA-Si用作应变调节剂,有助于减少残留应变,从而在缓冲液和底物区域引入位错。然而,观察到残余应变和表面形态取决于UTA-Si缓冲层的厚度以及合金层的生长模式。

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