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Molecular simulation on interfacial structure and gettering efficiency of direct silicon bonded (110)/(100) substrates

机译:直接硅键合(110)/(100)基底的界面结构和吸杂效率的分子模拟

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摘要

Direct silicon bonded (DSB) substrates with (110)/(100) hybrid orientation technology are attracting considerable attention as a promising technology for high performance bulk complementary metal-oxide semiconductor technology. We have investigated the structure and the gettering efficiency of the (110)/(100) interface parallelling each (110) direction (DSB interface) by molecular dynamics (MD) and first-principles calculation. In MD calculations, initial calculation cells of 15 atomic-configurations with coincidence-site lattices were prepared. It was found that (i) the calculated DSB interface was stable independent of the initial atomic-configurations and (ii) the interfacial structures were essentially the same among the calculated models. Moreover, the calculated interfacial structure corresponds to the reported TEM observation. The first-principles calculation showed that Si atoms in the DSB interface formed covalent bonding. The dangling bonds in Si (110) and (100) surfaces disappeared due to restructuring in the DSB interface. Furthermore, the DSB interface, which exists just below the device active region, was found to be an efficient gettering site for Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, and Hf atoms.
机译:具有(110)/(100)混合取向技术的直接硅键合(DSB)衬底作为高性能体互补金属氧化物半导体技术的有前途的技术受到了广泛的关注。我们已经通过分子动力学(MD)和第一性原理计算研究了平行于(110)方向(DSB界面)的(110)/(100)界面的结构和吸杂效率。在MD计算中,准备了具有重合点晶格的15个原子构型的初始计算单元。发现(i)所计算的DSB界面是稳定的,与初始原子构型无关,并且(ii)所计算的模型之间的界面结构基本相同。而且,计算出的界面结构对应于报道的TEM观察。第一性原理计算表明,DSB界面中的Si原子形成了共价键。 Si(110)和(100)表面中的悬空键由于DSB界面中的重组而消失。此外,发现存在于器件有源区正下方的DSB界面是Al,Sc,Ti,V,Cr,Mn,Fe,Co,Ni,Cu,Zn和Hf原子的有效除杂位。

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  • 来源
    《Journal of Applied Physics 》 |2010年第11期| P.113509.1-113509.6| 共6页
  • 作者单位

    Department of System Engineering, Okayama Prefectural University, 111 Kuboki, Soja, Okayama 719-1197, Japan;

    rnDepartment of System Engineering, Okayama Prefectural University, 111 Kuboki, Soja, Okayama 719-1197, Japan Covalent Materials Co., Ltd., Higashikou, Seirou-machi, Kitakanbara-gun, Niigata 957-0197, Japan;

    rnCovalent Materials Co., Ltd., Higashikou, Seirou-machi, Kitakanbara-gun, Niigata 957-0197, Japan;

    rnDepartment of System Engineering, Okayama Prefectural University, 111 Kuboki, Soja, Okayama 719-1197, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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