...
首页> 外文期刊>Journal of Applied Physics >Improvements in thermionic cooling through engineering of the heterostructure interface using Monte Carlo simulations
【24h】

Improvements in thermionic cooling through engineering of the heterostructure interface using Monte Carlo simulations

机译:通过使用Monte Carlo模拟对异质结构界面进行工程设计来改善热电子冷却

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

A self-consistent Ensemble Monte Carlo (EMC) model was developed to simulate the thermionic effect in heterostructure barrier coolers. The model was validated on an InGaAs-InGaAsP heterostructure device of variable barrier height and width, producing good quantitative agreement with previous literature results. The operation of the cooler was found to be a complex and intricate process depending on the field, conduction band and details of barrier structure. When applied to a GaAs-AlGaAs micro-cooler there was good agreement with the experimental results. Importantly, very small alterations in the barrier structure were found to lead to considerable changes in device performance.
机译:建立了一个自洽的蒙特卡罗综合模型(EMC),以模拟异质结构势垒冷却器中的热电子效应。该模型在可变势垒高度和宽度的InGaAs-InGaAsP异质结构器件上进行了验证,与先前的文献结果具有良好的定量一致性。根据场,导带和势垒结构的细节,发现冷却器的运行是一个复杂而复杂的过程。当应用于GaAs-AlGaAs微型冷却器时,与实验结果吻合良好。重要的是,发现势垒结构的很小变化会导致器件性能发生重大变化。

著录项

  • 来源
    《Journal of Applied Physics》 |2013年第4期|043717.1-043717.8|共8页
  • 作者单位

    Department of Physics, University of Aberdeen, King's College, AB24 3UE Aberdeen, United Kingdom;

    Department of Physics, University of Aberdeen, King's College, AB24 3UE Aberdeen, United Kingdom;

    Department of Engineering, DeMontfort University, Gateway, LE1 9BH Leicester, United Kingdom;

    Department of Engineering, DeMontfort University, Gateway, LE1 9BH Leicester, United Kingdom;

    Center for Device Thermography and Reliability, H. H. Wills Physics Laboratory, University of Bristol,BS8 1TL Bristol, United Kingdom;

    School of Engineering, University of Glasgow, Rankine Building, G12 8LT Glasgow, United Kingdom;

    School of Engineering, University of Glasgow, Rankine Building, G12 8LT Glasgow, United Kingdom;

    Center for Device Thermography and Reliability, H. H. Wills Physics Laboratory, University of Bristol,BS8 1TL Bristol, United Kingdom;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号