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首页> 外文期刊>Journal of Applied Physics >Structural characterisation of BaTiO_3 thin films deposited on SrRuO_3/YSZ buffered silicon substrates and silicon microcantilevers
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Structural characterisation of BaTiO_3 thin films deposited on SrRuO_3/YSZ buffered silicon substrates and silicon microcantilevers

机译:沉积在SrRuO_3 / YSZ缓冲硅衬底和硅微悬臂上的BaTiO_3薄膜的结构表征

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摘要

We report on the progress towards an all epitaxial oxide layer technology on silicon substrates for epitaxial piezoelectric microelectromechanical systems. (101)-oriented epitaxial tetragonal BaTiO_3 (BTO) thin films were deposited at two different oxygen pressures, 5.10~(-2) mbar and 5.10~(-3) mbar, on SrRuO_3/Yttria-stabilized zirconia (YSZ) buffered silicon substrates by pulsed laser deposition. The YSZ layer full (001) orientation allowed the further growth of a fully (HO)-oriented conductive SrRuO_3 electrode as shown by X-ray diffraction. The tetragonal structure of the BTO films, which is a prerequisite for the piezoelectric effect, was identified by Raman spectroscopy. In the BTO film deposited at 5.10~(-2) mbar strain was mostly localized inside the BTO grains whereas at 5.10~(-3) mbar, it was localized at the grain boundaries. The BTO/SRO/YSZ layers were finally deposited on Si microcantilevers at an O_2 pressure of 5.10~(-3) mbar. The strain level was low enough to evaluate the BTO Young modulus. Transmission electron microscopy (TEM) was used to investigate the epitaxial quality of the layers and their epitaxial relationship on plain silicon wafers as well as on released microcantilevers, thanks to Focused-Ion-Beam TEM lamella preparation.
机译:我们报告了外延压电微机电系统在硅基板上采用全外延氧化层技术的进展。 (101)取向的外延四方BaTiO_3(BTO)薄膜在SrRuO_3 /氧化钇稳定的氧化锆(YSZ)缓冲硅衬底上以5.10〜(-2)mbar和5.10〜(-3)mbar的两种不同氧气压力沉积。通过脉冲激光沉积。 XS射线衍射显示,YSZ层完全(001)取向允许完全(HO)取向的导电SrRuO_3电极进一步生长。通过拉曼光谱法确定了BTO膜的四方结构,这是压电效应的先决条件。在5.10〜(-2)mbar应变下沉积的BTO薄膜大部分位于BTO晶粒内部,而在5.10〜(-3)mbar则位于晶粒边界。 BTO / SRO / YSZ层最终以5.10〜(-3)mbar的O_2压力沉积在Si微悬臂梁上。应变水平低到足以评估BTO杨氏模量。借助聚焦离子束TEM薄片制备,使用透射电子显微镜(TEM)来研究各层的外延质量及其在普通硅片以及已释放的微悬臂上的外延关系。

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  • 来源
    《Journal of Applied Physics 》 |2014年第5期| 053506.1-053506.9| 共9页
  • 作者单位

    GREYC, UMR 6072, CNRS, ENSICAEN, UCBN, 6 bd du Marechal Juin, 14050 Caen Cedex, France;

    LAMIPS, CRISMAT-NXP Semiconductors-Presto Engineering laboratory, CNRS-UMR 6508, ENSICAEN, UCBN, 2 rue de la Girafe, 14 000 Caen, France;

    GREYC, UMR 6072, CNRS, ENSICAEN, UCBN, 6 bd du Marechal Juin, 14050 Caen Cedex, France;

    CIMAP, UMR 6252, CNRS, ENSICAEN, UCBN, CEA, 6 bd du Marechal Juin, 14050 Caen Cedex, France;

    CIMAP, UMR 6252, CNRS, ENSICAEN, UCBN, CEA, 6 bd du Marechal Juin, 14050 Caen Cedex, France;

    LAAS, CNRS, Univ de Toulouse, 7 avenue du Colonel Roche, 31400 Toulouse, France;

    LAAS, CNRS, Univ de Toulouse, 7 avenue du Colonel Roche, 31400 Toulouse, France;

    GREYC, UMR 6072, CNRS, ENSICAEN, UCBN, 6 bd du Marechal Juin, 14050 Caen Cedex, France,Department of Industrial Engineering, CNR-SPIN Salerno, Universita di Salerno, 84084 Fisciano, Salerno, Italy;

    GREYC, UMR 6072, CNRS, ENSICAEN, UCBN, 6 bd du Marechal Juin, 14050 Caen Cedex, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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