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首页> 外文期刊>Journal of Applied Physics >Preface to Special Topic: Reactive high power impulse magnetron sputtering
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Preface to Special Topic: Reactive high power impulse magnetron sputtering

机译:特殊主题的序言:无功大功率脉冲磁控溅射

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摘要

Magnetron sputtering is a widely used physical vapor deposition technique that has been applied successfully by various industries for the deposition of thin films and coatings for over four decades. The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma-based sputtering. In HiPIMS, high power is applied to the magnetron target in unipolar pulses at a low duty cycle and low repetition frequency while keeping the average power about two orders of magnitude lower than the peak power. This high discharge power leads to the generation of a very high density plasma and thus a high ionization fraction of sputtered atoms. Thus, for the sputtered material, the ion flux is larger than the neutral flux and HiPIMS can be referred to as ionized physical vapor deposition. Ionized sputtered flux allows for controlled ion bombardment of the growing film by the acceleration of the sputtered material across the plasma sheath created by a negative bias applied to the substrate.
机译:磁控溅射是一种广泛使用的物理气相沉积技术,已成功应用于各个行业,用于沉积薄膜和涂层已有四十年之久。高功率脉冲磁控溅射(HiPIMS)放电是基于等离子体的溅射的最新成员。在HiPIMS中,高功率以低占空比和低重复频率以单极脉冲形式施加到磁控管靶上,同时使平均功率比峰值功率低大约两个数量级。这种高放电功率导致产生非常高密度的等离子体,并因此导致溅射原子的高电离率。因此,对于溅射材料,离子通量大于中性通量,HiPIMS可以称为电离物理气相沉积。电离的溅射通量允许通过溅射材料跨过等离子体护套的加速的溅射离子的受控轰击,该溅射是由施加到基板的负偏压产生的,穿过等离子体鞘。

著录项

  • 来源
    《Journal of Applied Physics 》 |2017年第17期| 171801.1-171801.4| 共4页
  • 作者单位

    Institute for Experimental Physics II, Ruhr-University Bochum, 44801 Bochum, Germany;

    Science Institute, University of Iceland, Dunhaga 3, IS-107 Reykjavik, Iceland, Department of Space and Plasma Physics, School of Electrical Engineering, KTH-Royal Institute of Technology, SE-100 44, Stockholm, Sweden;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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