A Novel Method of Removing Impurities from Multilevel Interconnect Materials

Takuya FUKUDA; Hiroshi YANAZAWA

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A Novel Method of Removing Impurities from Multilevel Interconnect Materials

机译：一种去除多层互连材料中杂质的新方法

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摘要

A novel method of removing impurities from dielectric films has been developed. The removal of water and charges is accomplished by humidification and wet pretreatment followed by charge extraction with CO_2 supercritical fluid (SCF). Films treated in this manner exhibit intrinsic properties, which are usually masked by moisture and impurities.

机译：已经开发了从介电膜去除杂质的新方法。通过加湿和湿法预处理，然后用CO_2超临界流体（SCF）进行电荷萃取，可以去除水和电荷。以这种方式处理的膜表现出固有的特性，通常被水分和杂质掩盖。

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《Japanese Journal of Applied Physics. Part 1, Regular Papers & Short Notes》 |2004年第3期|p.936-939|共4页
作者
Takuya FUKUDA; Hiroshi YANAZAWA;
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作者单位

Association of Super-Advanced Electronics Technologies (ASET), 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa 244-0817, Japan;

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正文语种 eng
中图分类应用物理学;
关键词
supercritical; CO_2; low-k; dehydration; impurity removal; leakage current; I-V characteristics; C-V characteristics;

机译：超临界CO_2低k脱水杂质去除漏电流I-V特性C-V特性;

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A Novel Method of Removing Impurities from Multilevel Interconnect Materials

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