首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Experimental and Numerical Studies on dV/dt Robustness of 1200 V High-Voltage Integrated Circuits Using Self-Isolation Structure
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Experimental and Numerical Studies on dV/dt Robustness of 1200 V High-Voltage Integrated Circuits Using Self-Isolation Structure

机译:采用自隔离结构的1200 V高压集成电路dV / dt鲁棒性的实验和数值研究

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摘要

Experimental results on the high-voltage level shifter and dV/dt robustness of 1200V high voltage integrated circuits (HVICs) using a self-isolation (SI) structure are reported for the first time. Generally, because high dV/dt stress is applied to HVICs during insulated gate bipolar transistor (IGBT) switching, significant displacement current flows through a high-voltage isolation capacitance. This current acts as the base current of parasitic pnp and npn transistors, and causes a potential drop in their base region. In the worst case, this parasitic operation causes device destruction. In this study, not only the normal operation of HVICs but suppression of the parasitic transistors under high dV/dt condition are experimentally demonstrated by considering a high-side layout design and back diverter electrode.
机译:首次报道了采用自隔离(SI)结构的1200V高压集成电路(HVIC)的高压电平转换器和dV / dt鲁棒性的实验结果。通常,由于在绝缘栅双极晶体管(IGBT)切换期间会向HVIC施加较高的dV / dt应力,因此大量的位移电流会流经高压隔离电容。该电流充当寄生pnp和npn晶体管的基极电流,并在其基极区域引起电势下降。在最坏的情况下,这种寄生操作会导致器件损坏。在这项研究中,不仅考虑了HVIC的正常工作,而且还考虑了高端布局设计和背向分流电极,从而在高dV / dt条件下抑制了寄生晶体管。

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