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首页> 外文期刊>Japanese journal of applied physics >Algaas/ingaas High Electron Mobility Transistor Grown On Si Substrate With Ge/ge_xsi_(1-x) Metamorphic Buffer Layers
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Algaas/ingaas High Electron Mobility Transistor Grown On Si Substrate With Ge/ge_xsi_(1-x) Metamorphic Buffer Layers

机译:在具有Ge / ge_xsi_(1-x)变质缓冲层的Si衬底上生长的藻类/ ingaas高电子迁移率晶体管

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摘要

Al_(0.12)Ga_(0.88)As/In_(0.18)Ga_(0.82)As high-electron-mobility transistor (HEMT) growth on a Si substrate using the Ge/Ge_xSi_(1-x) buffer is demonstrated. This is the first demonstration of Al_(0.12)Ga_(0.88)As/In_(0.18)Ga_(0.82)As HEMT growth on a Ge/Ge_xSi_(1-x) metamorphic buffer layer. The electron mobility in the In_(0.18)Ga_(0.82)As channel of the HEMT sample was 3,550 cm~2/(V·s). After fabrication, the HEMT device demonstrated a saturation current of 150 mA/mm with a transconductance of 155 mS/ mm. The well behaved characteristics of the HEMT device on the Si substrate are believed to be due to the very thin buffer layer achieved and the lack of the antiphase boundary (APB) formation and Ge diffusion into the GaAs layers.
机译:说明了使用Ge / Ge_xSi_(1-x)缓冲剂在Si衬底上生长Al_(0.12)Ga_(0.88)As / In_(0.18)Ga_(0.82)As作为高电子迁移率晶体管(HEMT)。这是在Ge / Ge_xSi_(1-x)变质缓冲层上Al_(0.12)Ga_(0.88)As / In_(0.18)Ga_(0.82)As HEMT生长的首次演示。 HEMT样品在In_(0.18)Ga_(0.82)As通道中的电子迁移率为3,550 cm〜2 /(V·s)。制作后,HEMT器件的饱和电流为150 mA / mm,跨导为155 mS / mm。据信,HEMT器件在Si衬底上表现良好的特性归因于所获得的缓冲层非常薄,并且缺乏反相边界(APB)的形成以及Ge扩散到GaAs层中。

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