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Impact of Ge Content on Flicker Noise Behavior of Strained-SiGe p-Type Metal-Oxide-Semiconductor Field-Effect Transistors

机译:Ge含量对应变SiGe p型金属氧化物半导体场效应晶体管闪烁噪声行为的影响

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摘要

The DC characteristic and low-frequency (1/f) noise behavior of strained-Si_(1-x)Ge_x p-type metal-oxide-semiconductor field-effect transistors (pMOSFETs) with 15 and 30% Ge channel have been investigated and compared with those of Si control counterparts. Enhancement in effective hole mobility of 24 and 45% were obtained in strained-SiGe devices with a 15 and 30% Ge channel, respectively. The strained-SiGe pMOSFETs with a higher Ge buried channel exhibit lower 1/ f noise, indicating that more carriers are confined in the SiGe channel and interface scattering is remote. Moreover, we also found that the Ge concentration plays an important role in the noise mechanism. A new observation shows that carrier number fluctuation is more suitable for interpreting the mechanism of 1/f noise in strained-SiGe devices with 30% Ge channel, while both number fluctuation noise and mobility fluctuation noise are likely to contribute to the characteristics of SiGe pMOSFETs with 15% Ge and the Si control device.
机译:研究了具有15%和30%Ge沟道的应变Si_(1-x)Ge_x p型金属氧化物半导体场效应晶体管(pMOSFET)的直流特性和低频(1 / f)噪声行为,并且与硅控制同行相比。在具有15%和30%Ge通道的应变SiGe器件中,有效空穴迁移率分别提高了24%和45%。具有较高Ge埋入沟道的应变SiGe pMOSFET表现出较低的1 / f噪声,表明更多的载流子被限制在SiGe沟道中,并且界面散射很小。此外,我们还发现,Ge浓度在噪声机制中起着重要作用。一项新的观察结果表明,载流子数波动更适合于解释具有30%Ge沟道的应变SiGe器件中的1 / f噪声的机理,而数量波动噪声和迁移率波动噪声都可能有助于SiGe pMOSFET的特性含15%的Ge和Si控制装置。

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  • 来源
    《Japanese journal of applied physics》 |2009年第4issue2期|165-168|共4页
  • 作者单位

    Department of Electronic Engineering, Cheng Shiu University, Niaosong, Kaohsiung 833, Taiwan, R.O.C.;

    Department of Electronic Engineering, Cheng Shiu University, Niaosong, Kaohsiung 833, Taiwan, R.O.C.;

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;

    Department of Electronic Engineering, Cheng Shiu University, Niaosong, Kaohsiung 833, Taiwan, R.O.C.;

    Institute of Microelectronics and Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan;

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