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机译:热退火对纳米Si Fin中掺杂物再分布的影响
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan;
机译:逐步击穿过程中纳米级MOSFET的衬底-源极/漏极p-n结处掺杂物重新分布的研究
机译:重掺杂磷的外延硅膜的化学键合状态和掺杂剂的重新分布:毫秒激光退火和掺杂浓度的影响
机译:纳米级nMOSFET中量子限制和随机掺杂效应的三维模拟
机译:纳米级鳍型场效应晶体管中随机掺杂阈值电压波动的三维模拟
机译:对纳米级三栅MOSFET中的随机掺杂剂波动效应进行建模。
机译:调整杂化掺杂石墨烯和Ag3PO4复合材料的近能隙电子结构界面电荷转移和可见光响应:掺杂剂效应
机译:一种在制造检测比较期间多层结构中掺杂剂再分配的方法。核对再分配的非线性,参数和辐射缺陷的时间依赖性。
机译:掺杂和杂质重分布对快速热处理Wsi(2)形成的影响