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首页> 外文期刊>Japanese journal of applied physics >Morphological and Structural Changes in Cu(ln,Ga)Se_2 Thin Films by Selenization Using Diethylselenide
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Morphological and Structural Changes in Cu(ln,Ga)Se_2 Thin Films by Selenization Using Diethylselenide

机译:硒化二硒硒化Cu(ln,Ga)Se_2薄膜的形貌和结构变化

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摘要

The morphological and structural changes in Cu(ln,Ga)Se_2 (CIGS) thin films during selenization using diethylselenide (DESe) are investigated. The surface morphology and extra phase existence of CIGS thin films strongly depend on the heating profile temperature and time of each step during selenization. Conventional high-temperature (515℃) selenized CIGS thin films formed grains of approximately 2-3 μm, although the Cu-In-Ga metallic precursor was very smooth. On the other hand, the precursor selenized at a low temperature (about 400℃) exhibited a homogeneous surface morphology because the precursor was formed from Cu-Se and (In.Ga)-Se alloys to diffuse selenide into a Cu-In-Ga metallic precursor. The high-temperature selenized CIGS thin films after low-temperature selenization had a homogeneous surface morphology with appropriate-sized grains. These results indicate that the heating profile "during" selenization was very important in forming Cu-Se and (ln,Ga)-Se alloys from a Cu-ln-Ga metallic precursor.
机译:研究了硒化二乙基硒(DESe)硒化过程中Cu(ln,Ga)Se_2(CIGS)薄膜的形貌和结构变化。 CIGS薄膜的表面形态和多余相的存在强烈取决于硒化过程中加热曲线的温度和每个步骤的时间。尽管Cu-In-Ga金属前驱体非常光滑,但常规的高温(515℃)硒化CIGS薄膜仍会形成约2-3μm的晶粒。另一方面,在低温(约400℃)下硒化的前驱体表现出均匀的表面形貌,因为前驱体由Cu-Se和(In.Ga)-Se合金形成,从而将硒化物扩散到Cu-In-Ga中金属前体。低温硒化后的高温硒化CIGS薄膜具有均匀的表面形貌和适当大小的晶粒。这些结果表明,硒化过程中的加热过程对于从Cu-In-Ga金属前驱体形成Cu-Se和(In,Ga)-Se合金非常重要。

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  • 来源
    《Japanese journal of applied physics》 |2011年第5issue3期|p.05FB05.1-05FB05.4|共4页
  • 作者单位

    Department of Electrical Engineering, Faculty of Science and Technology, Tokyo University of Science, Noda, Chiba 278-8510, Japan;

    Department of Electrical Engineering, Faculty of Science and Technology, Tokyo University of Science, Noda, Chiba 278-8510, Japan;

    Department of Electrical Engineering, Faculty of Science and Technology, Tokyo University of Science, Noda, Chiba 278-8510, Japan;

    CANTech, Institute of Multidisciplinary Research for Advanced Materials, Tohoku University, Sendai 980-8577, Japan;

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