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首页> 外文期刊>Japanese journal of applied physics >Above-Complementary Metal-Oxide-Semiconductor Metal Pattern Technique for Postfabrication Tuning of On-Chip Inductor Characteristics
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Above-Complementary Metal-Oxide-Semiconductor Metal Pattern Technique for Postfabrication Tuning of On-Chip Inductor Characteristics

机译:片上电感器特性的后制造调整的互补金属氧化物半导体金属图案技术

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摘要

In the design of radio frequency (RF) circuits, modifying the characteristics of an inductor in efficient way is required to realize rapid prototyping of RF system-on-a-chip (SoC). We propose an above-complementary-metal-oxide-semiconductor (above-CMOS) metal pattern technique. In this technique, metal patterns are formed using a simple process on the passivation layer above the on-chip inductor. Since the metal pattern with different shapes has different effects, we can tune the characteristics of an on-chip inductor by forming various metal patterns in a chip-by-chip manner. This method can experimentally create various inductors from an identical on-chip inductor. Therefore, the optimization of inductor characteristics and related circuit performance can be carried out in a short period and at a low cost on a trial-and-error basis, which is very effective for rapid prototyping of RF SoCs. Adjustment of the oscillation frequency of the voltage-controlled oscillator using this technique and the technique of modeling the above-CMOS metal pattern are also described in this paper.
机译:在射频(RF)电路的设计中,需要以有效的方式修改电感器的特性,以实现RF片上系统(SoC)的快速原型制作。我们提出了一种以上互补的金属氧化物半导体(CMOS以上)金属图案技术。在该技术中,使用简单的工艺在片上电感器上方的钝化层上形成金属图案。由于具有不同形状的金属图案具有不同的效果,因此我们可以通过逐个芯片地形成各种金属图案来调整片上电感器的特性。这种方法可以通过实验从相同的片上电感器创建各种电感器。因此,电感特性和相关电路性能的优化可以在短时间内以反复试验的低成本进行,这对于RF SoC的快速原型制作非常有效。本文还介绍了使用该技术调整压控振荡器的振荡频率以及对上述CMOS金属图案进行建模的技术。

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  • 来源
    《Japanese journal of applied physics 》 |2011年第4issue2期| p.04DB04.1-04DB04.5| 共5页
  • 作者单位

    Department of Electronics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;

    Department of Electronics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;

    Department of Electronics, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan;

    Solution Research Laboratory, Tokyo Institute of Technology, Yokohama 226-8503, Japan,Research Institute for Nanodevice and Bio Systems, Hiroshima University, Higashihiroshima, Hiroshima 739-8527, Japan;

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